Training

Oct
23
Mon
AC++11-401 Transitioning to C++11/C++14 @ Feabhas
Oct 23 – Oct 26 all-day
Oct
30
Mon
AC-401 Advanced C Programming @ Feabhas
Oct 30 – Nov 2 all-day
IPC Training Calendar 2017 – J-STD-001 Application Specialist CIS Certification Training @ Advanced Rework Technology
Oct 30 – Nov 3 all-day
Nov
6
Mon
EL-504 Developing Linux Device Drivers @ Feabhas
Nov 6 – Nov 10 all-day
IPC Training Calendar 2017 – IPC 610 Trainer CIT Certification Training @ Advanced Rework Technology
Nov 6 – Nov 10 all-day
Nov
9
Thu
SMART/NPL Process, Design & Reliability Seminar @ NPL
Nov 9 @ 9:30 am – 4:00 pm
SMART/NPL Process, Design & Reliability Seminar @ NPL | Teddington | England | United Kingdom

SMART/NPL Process, Design & Reliability Seminar.  This seminar will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, high temperature reliability for alternative solders and substrates materials

Thursday 9th November starting at 9.30am, coffee at 9.00am and finishing at 4.00pm

In addition, one of the presentations will focus on the best methods to evaluate solder joint reliability, how to test and what to expect in terms of failure with different test methods. Delegates will be provided with a full list of the NPL Project Report Database and can select documents for FREE download

Each delegate will receive a copy of all the slides presented, two HT Project Reports plus a set of SMART Group High Temperature Soldering & Defect Guide Posters

 

Table Top Exhibition space will be limited at this event, book you place early to avoid disappointment Click Here

Nov
13
Mon
AC++501 Advanced C ++ for Embedded Systems @ Feabhas
Nov 13 – Nov 17 all-day
IPC Training Calendar 2017 – J-STD-001 Trainer CIT Certification Training @ Advanced Rework Technology
Nov 13 – Nov 17 all-day
BGA, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination @ Online
Nov 13 @ 2:30 pm – 3:30 pm

Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination.  This webinar includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering

Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. A FREE copy of Bob’s Ebook on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course

For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

 

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Ball Grid

Nov
14
Tue
Productronica @ Messe Munchen
Nov 14 – Nov 17 all-day