Training

Aug
21
Mon
IPC Training Calendar 2017 – J-STD-001 Application Specialist CIS Certification Training @ Advanced Rework Technology
Aug 21 – Aug 25 all-day
Sep
1
Fri
IPC Training Calendar 2017 – J-STD-001 Space Addendum Certification Training for CIT /CIS @ Advanced Rework Technology
Sep 1 all-day
Sep
4
Mon
IPC Training Calendar 2017 – J-STD-001 Trainer CIT Certification Training @ Advanced Rework Technology
Sep 4 – Sep 8 all-day
Sep
11
Mon
EL-503 Developing for Embedded Linux @ Feabhas
Sep 11 – Sep 15 all-day
IPC Training Calendar 2017 – IPC 610 Trainer CIT Certification Training @ Advanced Rework Technology
Sep 11 – Sep 15 all-day
PCB Outgassing & How to Test Bare or Assembled Boards @ Online
Sep 11 @ 2:30 pm – 3:30 pm
PCB Outgassing & How to Test Bare or Assembled Boards @ Online

PCB Outgassing:

Printed circuit boards outgas during soldering causing solder voids, solder balls and other process problems. Outgassing can occur in wave, selective and reflow soldering and it’s important first to non-destructively test samples to find the root cause. It’s possible to test bare or assembled boards to examine the potential for failure and eliminate some of the popular misconception in industry. There some different methods which can easily be conducted in manufacture before proceeding to costly laboratory analysis and we show you how to do it and the typical results you can find!!

The webinar will last approximately 60-90mins including question and answer session

Presented by Bob Willis

Topics covered:

Type of outgassing from vias, through holes and solder masks
How to Test samples in manufacture
Test method procedures
Type of defects and how they can appear with tin/lead and lead-free alloys
Void formation in wave selective and PIHR joints
Correct specification of your boards

A copy of the slides presented during the webinar are provided at the end of the event along with a written procedure for testing.

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Sep
12
Tue
RTOS-301 Developing for Real-Time Operating Systems with FreeRTOS @ Feabhas
Sep 12 – Sep 14 all-day
Sep
14
Thu
AE-101 Introduction to Agile @ Feabhas
Sep 14 all-day
Productronica India @ Pragati Maidan
Sep 14 – Sep 16 all-day
QFN/LGA & Bottom Mounted Termination Process Defects @ Henkel
Sep 14 @ 9:30 am – 4:00 pm
QFN/LGA & Bottom Mounted Termination Process Defects @ Henkel | Hemel Hempstead | England | United Kingdom

QFN/LGA & Bottom Mounted Termination Process Defects – Causes & Cures, Thursday 14th September starting at 9.30am, coffee at 9.00am and finishing at 4.00pm

Henkel
Hemel Hempstead
UK

Table Top Exhibition space will be limited at this event, book you place early to avoid disappointment

The workshop will consider design, process and materials to reduce or eliminate common issues seen on QFN/LGA & Bottom Mounted Termination Components. These packages are being used in the most demanding environments and their use will increase with larger packages and increasing process issues

 

Defect issues being addressed in the workshop will include:

Solder joint reliability improvements
Successful cleaning under parts
Void formation and elimination
Reliability issue with conformal coating
Improvements in side solder fillet formation

We will be arranging some hands-on soldering demonstrations with QFN/LGA & Bottom Mounted Components to best illustrate improvements in soldering yields. The SMART Group event is ideal for design, process and quality engineers. It will also benefit component and PCB suppliers

Each delegate will receive a copy of all the slides presented plus a set of SMART Group QFN/LGA & Bottom Mounted Termination Process Defects & Inspection Posters

 

Download Booking Form