SMART/NPL Process, Design & Reliability Seminar

9th November 2017 @ 9:30 am – 4:00 pm
£85 - £175
Keith Bryant
SMART/NPL Process, Design & Reliability Seminar @ NPL | Teddington | England | United Kingdom

SMART/NPL Process, Design & Reliability Seminar.  This seminar will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, high temperature reliability for alternative solders and substrates materials

Thursday 9th November starting at 9.30am, coffee at 9.00am and finishing at 4.00pm

In addition, one of the presentations will focus on the best methods to evaluate solder joint reliability, how to test and what to expect in terms of failure with different test methods. Delegates will be provided with a full list of the NPL Project Report Database and can select documents for FREE download

Each delegate will receive a copy of all the slides presented, two HT Project Reports plus a set of SMART Group High Temperature Soldering & Defect Guide Posters


Table Top Exhibition space will be limited at this event, book you place early to avoid disappointment Click Here

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