Indium Corporation Experts to Present at SMTA’s South East Asia Technical Conference 2017

Indium_Ning-Cheng LeeIndium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and other company experts will present at SMTA’s South East Asia Technical Conference on Electronics Assembly Technologies 2017, March 28-30, in Penang, Malaysia.

Dr. Lee will instruct a two-part seminar on Choosing Solders for the New Era on Tuesday, March 28. Part one will take place from 8:30 a.m. to noon and focus on lead-free solder alloys, and part two will run from 1:30-5 p.m. and discuss low-temperature solders.

Jonas Sjoberg, Technical Manager, will chair the Advanced Packaging session on Thursday, March 30.

Technical presentations by Indium Corporation experts include:

  • Voiding Control at LED Die-Attach Preform Soldering by Dr. Lee
  • Assessment of Solder Paste Technology Limitation for Printing Applications by Dr. Lee
  • Process Optimization for Cold Joint and Tombstone Improvement in SiP Package by Jason Chou, Area Technical Manager – Taiwan
  • System-in-Package (SiP) Assembly vs. Solder Paste Attributes by Kenneth Thum, Senior Technical Support Engineer

For more information on the technical sessions offered at SMTA’s South East Asia Technical Conference, visit

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